<p>Provided is a testing wafer unit which is electrically connected with a plurality of chips to be tested formed on the wafer to be tested and which comprises a connecting wafer which is arranged in opposition to the wafer to be tested and which is electrically connected to the chip to be tested and a temperature distribution adjusting unit which is mounted on the connecting wafer and which adjusts the temperature distribution of the wafer to be tested. In the testing wafer unit, the connecting wafer has a shape corresponding to the wafer to be tested. The temperature distribution adjusting unit is provided at a position in opposition to the chip to be tested. The temperature distribution adjusting unit desirably has a plurality of individual temperature adjusting units for adjusting the temperature of the chip to be tested.</p>
