ELECTRICAL INTERCONNECTING STRUCTURE, PROCESS OF MANUFACTURING THE SAME, AND CIRCUIT BOARD STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an electrical interconnecting structure suitable for a circuit board.

SOLUTION: The electrical interconnecting structure includes a core, an ultra fine pattern, and a patterned conductive layer. The core has a surface, and the ultra fine pattern is inlaid in the surface of the core. The patterned conductive layer is disposed on the surface of the core and is partially connected to the ultra fine pattern. Since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core.

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