发明名称 METHOD FOR PRODUCING SHIELD-COATING FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a shield-coating flexible printed wiring board in which the number of parts is reduced and by which production is effectively executed. SOLUTION: This method for producing the shield-coating flexible printed wiring board 1 includes the steps of forming a laminate board by laminating a shield-coating member 13, which is formed by depositing a metal thin film 13b on the inside surface of a shielding film 13a, on at least one side surface of a flexible printed wiring board 11 on which signal circuits 11b and a ground circuit 11c are formed, through an insulating adhesion sheet 12, wherein the insulating adhesion sheet 12 is made so as to have an opening 12a at the portion just above part of a ground circuit 11c, and the ground circuit 11c is directly jointed to the metal thin film 13b at an opening 12a of the insulating adhesion sheet 12 after the shield-coating member 13 is laminated on the flexible printed wiring board 11. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009278048(A) 申请公布日期 2009.11.26
申请号 JP20080130681 申请日期 2008.05.19
申请人 KYOCERA CHEMICAL CORP 发明人 HARA TAKASHI;NAKAMI HIROAKI
分类号 H05K3/46;H05K1/02;H05K3/28 主分类号 H05K3/46
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