| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prober which keeps a position accuracy in a high temperature inspection without reducing a throughput. Ž<P>SOLUTION: A prober includes: a casing 11, 12; a wafer chuck 16 holding a wafer with a chip formed; a card holder 17 which holds a probe card 19 having a probe 20; a head stage 13 which holds the card holder being fixed to the casing; an insulating portion 18 which insulates a connection portion between the head stage and card holder; a moving mechanism 14, 15; a chuck heating mechanism 31, 42 to heat the wafer chuck 16; a holder heating mechanism 32, 42 to heat the card holder 17; a cooling mechanism 34, 43 to cool the head stage 13; and a temperature control portion 41. The temperature control portion makes control to keep the head stage 13 at an atmospheric temperature by the cooling mechanism and to heat the card holder 17 to a predetermined high temperature by the holder heating mechanism when heating the wafer chuck to a predetermined high temperature. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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