发明名称 |
Thermal sensing and reset protection for an integrated circuit chip |
摘要 |
There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state. |
申请公布号 |
US2009289321(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
US20090387892 |
申请日期 |
2009.05.08 |
申请人 |
MINDSPEED TECHNOLOGIES, INC |
发明人 |
LI XIAOMING;MATIOUBIAN MISHEL;DHALIWAL SURINDERJIT |
分类号 |
H01L29/66;H01L21/98;H01L27/06 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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