| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability without increasing the number of components and the number of manufacturing processes by solving the problem, wherein reliability cannot be obtained because a junction part is deteriorated and cracks are generated on a boundary, or the like, with an electronic component by stress repeatedly due to the changes in dimensions caused by thermal expansion/contraction of molding resin, because of repeat of a temperature cycle of high and low temperatures in an electronic component mounting structure configured by integrally molding a lead frame of an on-vehicle sensor, or the like, which is used in severe environments of using conditions and weather conditions as a conducting pattern and a mounting electrode of the electronic component, together with the molding resin. Ž<P>SOLUTION: In the electronic component mounting structure configured by integrally molding the lead frame 1 as the conducting pattern and the electronic component mounting electrode (electronic component mounting surface 12) together with the molding resin 4, the lead frame 1 is provided with a pending portion 11. In the configuration, stress applied to a junction position 3 of the electronic component 2 can be markedly reduced, by deforming the pending part 11 and absorbing the stress. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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