| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inverter module achieving equalization of a current passing through respective insulation substrates in the case where an arm is formed of switching elements connected in parallel in different insulation substrates. <P>SOLUTION: Wiring patterns for drain in common between the switching element Q3a in a ceramic wiring board 21a and a switching element Q3b in a ceramic wiring board 21b are connected by a bonding wire 43 having an inductance L5 smaller than an inductance L1 formed at an energization path of the switching element Q3a in a wiring member 27 for positive electrode, and an inductance L2 formed at an energization path of the switching element Q3b in the wiring member 27 for positive electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT |
