RESIN COMPOSITION, AND COPPER FOIL WITH RESIN AND LAMINATED PRODUCT COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition affording a laminated product having a small dielectric loss in a high-frequency region and a dielectric constant that is large enough to reduce the size of a device and hardly suffers from changes with temperatures, a copper foil with the resin and a laminated product obtained by laminating the copper foil with the resin. SOLUTION: The resin composition comprises a cycloolefin polymer, a crosslinking agent and a highly dielectric filler, where the highly dielectric filler comprises an oxide having a composition represented by the general formula: (Li)x(Nd)1-xTiO3with x being 0.1-0.9. COPYRIGHT: (C)2010,JPO&INPIT