Verfahren zur Montage eines elektronischen Schaltungschips

摘要

In a method of mounting a planar electronic circuit chip (1) onto a flexible sheet (200) together with another planar electronic element (2,3), the electronic circuit part and the other electric element are selected so that the planar surface of the other electric element is greater than the planar surface of the electronic circuit chip, and the other electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the other electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.