发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of forming a pattern including a fine line and space pattern accurately. SOLUTION: The method of manufacturing the semiconductor device includes a step of forming a core material on a processed material, a step of forming a coating film formed of amorphous material to cover an upper surface and side surface of the core material, a step of forming a sidewall mask on a sidewall of the core material by removing the coating film while remaining a part positioned on the side surface of the core material, a step of crystallizing the coating film before or after processing into the sidewall mask by carrying out thermal treatment before or after forming the sidewall mask from the coating film, a step of removing the core material after crystallizing the coating film before or after forming the sidewall mask and processing into the sidewall mask, a step of etching the processed material by using the sidewall mask as a mask after removing the core material. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009278039(A) 申请公布日期 2009.11.26
申请号 JP20080130568 申请日期 2008.05.19
申请人 TOSHIBA CORP 发明人 ICHINOSE DAIGO;IGUCHI SUNAO
分类号 H01L21/3065;H01L21/027;H01L21/3213 主分类号 H01L21/3065
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