发明名称 |
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor package and a method of manufacturing the semiconductor package are provided. A semiconductor package according to the present general inventive concept may include a base substrate having one surface on which a connection terminal is formed and a first package substrate having a molding layer covering the base substrate. The molding layer faces a circumference of the connection terminal and includes a side surface having first and second surfaces having a circumference of a different size, respectively.
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申请公布号 |
US2009289359(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
US20090469253 |
申请日期 |
2009.05.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG CHUL-YONG;KIM PYOUNG-WAN;LEE TEAK-HOON |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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