| 摘要 |
PROBLEM TO BE SOLVED: To improve throughput by manufacturing a mask having a regular area by electronic drawing, developing the manufactured mask after being mask-exposed in turn on a mold by electron beam exposure, and manufacturing a mold having a large area in a short time with respect to a mold method for manufacturing. SOLUTION: The mold method for manufacturing includes: a step in which the mask is brought closer to a prescribed position of the mold coated with a resist to be positioned; a step in which the mask is irradiated with electron beams while being positioned close, and the electron beams which have passed through a minute pattern on the mask are exposed to the resist on the mask; a step in which the exposure is repeated after the mask, after being exposed, is positioned at the next position; a step in which the exposed resist on the mold is developed after the repetition; and a step in which the mold after being developed is etched, and a minute pattern corresponding to the minute pattern on the mask is formed on the mold. COPYRIGHT: (C)2010,JPO&INPIT |
