| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component package with a high reliability which achieves a gap height of a high precision upon bonding a substrate. Ž<P>SOLUTION: A measuring of a capacitance becomes possible such that electrodes 14, 16 for measuring the capacitance are formed face to face through an air gap with a gap height formed by a contact of a cover substrate 12 and an equipment substrate 11 by means of an slope 21a of a frame portion 19 and a bonding portion 15. The bonding portion 15 of the equipment substrate 11 and a slope bonding portion 17 formed on the slope 21a of the cover substrate 12 are formed in a relative portion. A gap height regulation side of the equipment substrate 11 is contacted with a parallel side 21b. The bonding portion 15 is deformed by a load upon bonding to form a slope, and the equipment substrate 11 and the cover substrate 12 are bonded. Thereby, the gap height can be exactly regulated. Further, a stress fluctuation of a gap between the equipment substrate and the cover substrate is suppressed, and the electronic component package with a high quality and the high reliability can be achieved. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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