发明名称 MOUNTING STRUCTURE OF BUILDING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure of a building panel, which can also be used for reform etc., and which has adequate strength and good workability. SOLUTION: This building panel A, which is composed of a wood-flour resin composite material 1 and has a thickness of 1-3 mm, is stuck on a surface 3 whereon the building panel A is to be stuck, by means of an adhesive tape 2 with a tape thickness of 0.7 mm or less, in such a manner that an area of the adhesive tape 2 used for the building panel A can be set at 20% or more. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005048442(A) 申请公布日期 2005.02.24
申请号 JP20030281237 申请日期 2003.07.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KONISHI SATORU;USUI HIROAKI;OKAMOTO KIYOSHI;MAEDA NAOHIKO;WATANABE TSUTOMU
分类号 E04F13/21;E04F13/18;(IPC1-7):E04F13/18 主分类号 E04F13/21
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