发明名称 |
PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE |
摘要 |
A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns.
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申请公布号 |
US2009290317(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
US20090468899 |
申请日期 |
2009.05.20 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MASHINO NAOHIRO |
分类号 |
H05K7/06;H05K1/18;H05K3/30 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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