| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a backside-illuminated solid-state imaging device that retains high reliability without causing any variation in imaging characteristics, especially to provide a method of forming a pad. SOLUTION: The method of manufacturing the solid-state imaging device includes a step of forming an on-chip color filter 19 and an on-chip microlens 21a on a light incidence surface side and then forming an opening 20 in the pad on the light incidence surface. COPYRIGHT: (C)2010,JPO&INPIT |
