CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, CHEMICAL MECHANICAL POLISHING METHOD, AND CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT

摘要

A chemical mechanical polishing aqueous dispersion includes: (A) an amino acid, (B) abrasive grains, (C) a surfactant, (D) an oxidizing agent, and (E) ammonia, the ratio (WA/WD) of the content (WA) of the amino acid to the content (WD) of the oxidizing agent being 1.5 to 6.0, and the ratio (WE/WD) of the content (WE) of the ammonia to the content (WD) of the oxidizing agent being 0.05 to 0.6.