DOUBLE-HEAD GRINDING APPARATUS AND WAFER MANUFACTURING METHOD

摘要

A double-head grinding apparatus is provided with at least a rotatable ring-like holder, which has a protruding section that engages with a notch and supports a thin-board-like wafer, which has the notch indicating crystal orientation, along the diameter direction from the outer circumference side; and a pair of grindstones for grinding the both surfaces of the wafer supported by the holder at the same time. In the double-head grinding apparatus, at least one protruding section is arranged on the holder in addition to the protruding section that engages with the notch for crystal orientation, the wafer is supported and rotated by making the protruding section engage with the notch formed on the wafer for supporting the wafer, and the both surfaces of the wafer are ground at the same time with the pair of grindstones. Thus, nano topography is improved by suppressing deformation of the notch periphery of the wafer in double-head grinding, and product yield is improved and apparatus cost is reduced by reducing breakage rate of the wafer and the holder by means of the double-head grinding apparatus and a wafer manufacturing method.