| 摘要 |
PROBLEM TO BE SOLVED: To permit prevention of wind up of adherend, such as wafer or the like, together with an adhesive sheet upon peeling the adhesive sheet. SOLUTION: The sheet peeling device 10 includes: a retaining means 11 for retaining the wafer W with an adhesive sheet S bonded thereto; a bonding means 14 for bonding a tape for peeling PT on the adhesive sheet S; and a peeling means 13 for peeling the adhesive sheet S from the wafer W through the tape for peeling PT. The peeling means 13 includes: a delivery and winding means 21 delivering and winding of the tape for peeling PT; and an angle regulating means 23 regulating a peeling angleαbetween the tape for peeling PT and/or adhesive sheet S and the wafer W by displacing the delivery and winding means 21. The delivery and winding means 21 is provided so that the most approaching part of the roller 27 for peeling with respect to the wafer W is neighbored to the bending position of the adhesive sheet S and that the peeled adhesive sheet S is pushed toward the side of the wafer W by the roller 27 for peeling. COPYRIGHT: (C)2010,JPO&INPIT |
