| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem, wherein when an external electrode of a multilayer ceramic electronic component is formed by direct plating on an end surface of a laminate, blister is caused during heat treatment which is undesirable in terms of the outer appearance. Ž<P>SOLUTION: The method for manufacturing the multilayer ceramic electronic component includes: a first step of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes, exposed at a predetermined surface of the laminate and growing the precipitates by plating so that the precipitates are mutually connected to coalesce into a continuous plated sublayer; and a second step of heat-treating the laminate including the plated sublayer at a temperature of at least about 800°C. A plated layer constituted of a plurality of plated sublayers is formed by continuously performing at least two cycles of the first step and the second step. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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