发明名称 |
CAPACITOR CHIP AND METHOD FOR MANUFACTURING SAME |
摘要 |
The present invention relates to a capacitor chip and a solid electrolytic capacitor, wherein in a capacitor chip in which one or more capacitor element is laminated on a metal lead frame to carry electricity and the whole is encapsulated with resin, a laminated body is located within a certain definite range. The present invention enables to increase the capacitance of a capacitor by broadening the allowable range of the total thickness of the laminated capacitor chips without generating defective appearance of the laminated solid electrolytic capacitor.
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申请公布号 |
US2009290292(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
US20060097338 |
申请日期 |
2006.12.14 |
申请人 |
SHOWA DENKO K. K. |
发明人 |
KOBAYASHI KENKI;KOMAZAWA EIJI;UTASHIRO TOMOYA |
分类号 |
H01G9/045;H01G9/00;H01G9/04 |
主分类号 |
H01G9/045 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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