发明名称 CAPACITOR CHIP AND METHOD FOR MANUFACTURING SAME
摘要 The present invention relates to a capacitor chip and a solid electrolytic capacitor, wherein in a capacitor chip in which one or more capacitor element is laminated on a metal lead frame to carry electricity and the whole is encapsulated with resin, a laminated body is located within a certain definite range. The present invention enables to increase the capacitance of a capacitor by broadening the allowable range of the total thickness of the laminated capacitor chips without generating defective appearance of the laminated solid electrolytic capacitor.
申请公布号 US2009290292(A1) 申请公布日期 2009.11.26
申请号 US20060097338 申请日期 2006.12.14
申请人 SHOWA DENKO K. K. 发明人 KOBAYASHI KENKI;KOMAZAWA EIJI;UTASHIRO TOMOYA
分类号 H01G9/045;H01G9/00;H01G9/04 主分类号 H01G9/045
代理机构 代理人
主权项
地址