发明名称
摘要 A flip-chip electrical coupling (100, 200, 300) is formed between first and second electrical components (110, 180; 410, 480). The coupling (100, 200, 300) includes a bump (240, 340) and a contact pad (315). The first electrical component (110, 210, 310, 410) includes the contact pad (315) electrically coupled to the first electrical component (110, 210, 310, 410) and a passivation layer (130, 230, 330) overlying the first electrical component (110, 210, 310, 410) and the contact pad (315). The passivation layer (130, 230, 330) is arranged having an opening (120, 220, 320) positioned over the contact pad (315). A bump (240, 340) is positioned overlying the opening (120, 220, 320) and substantially overlying the passivation layer (130, 230, 330). The bump (240, 340) is formed to be in electrical contact with the contact pad (315). The bump (240, 340) is arranged to couple the first and second electrical components (110, 180; 410, 480) during the flip-chip coupling process.
申请公布号 JP2009542029(A) 申请公布日期 2009.11.26
申请号 JP20090517524 申请日期 2007.06.20
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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