| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive film structure, its manufacturing method and a conductive film type integrated circuit probe device. <P>SOLUTION: The manufacturing method of the conductive film structure includes a step providing a flexible insulation substrate, a step of forming a conductive film on the flexible insulation substrate, a step of forming a plurality of fine conductive wires which are parallel each other in a long axis direction by patterning the conductive film on the flexible insulation substrate, a step of forming an insulation layer on the flexible insulation substrate and the fine conductive wire, and a step of forming a conductive block which is made by rolling or folding the flexible insulation substrate on the long axis direction center of the fine conductive wire. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
