| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor which can be separated into individual pieces by expanding and is superior in the case of filling recesses of a substrate during molding and has excellent solder reflow resistance. SOLUTION: Before being hardened, the adhesive sheet for a semiconductor, which has an adhesive layer, can be broken in an expanding test using a dynamic viscoelastic apparatus under conditions of 5°C, a frequency of≤500 Hz, and a displacement of≤95μm. COPYRIGHT: (C)2010,JPO&INPIT |
