| 摘要 |
PROBLEM TO BE SOLVED: To easily form a highly precise resistance part in order to performing impedance control using a passive element on a substrate. SOLUTION: A plurality of electrode pads 24 are formed in arrays in a peripheral edge part of an active surface 121a of a semiconductor device 121, and a passivation film 26 as a protective film is formed throughout the active surface of the semiconductor device 121, and openings 26a of the passivation film 26 are formed on surfaces of respective electrode pads 24. An organic resin film having a high stress relaxation property is formed on the passivation film 26. Resin projections 12 are formed on a surface of the passivation film 26 and inside electrode pad arrays 24a. The resin projections 12 are formed projectingly from the active surface 121a of the semiconductor device 121 and extend linearly at almost the same height and are arranged in parallel with the electrode pad arrays 24a. COPYRIGHT: (C)2010,JPO&INPIT |
