发明名称 LEAD-FREE SN-AG BASED SOLDER ALLOY OR SOLDER ALLOY POWDER
摘要 PROBLEM TO BE SOLVED: To provide a lead-free Sn-Ag based solder alloy and solder alloy powder, which are applicable under severe atmosphere related to the vibration and the heat. SOLUTION: This lead-free solder alloy is composed of, by weight, 0.10% Ni, 0.08% Al, 0.06% Ge, 0.2% Bi, 0.2% Ag and the balance Sn. The maximum stress of this lead-free solder alloy is 33.00 MPa, the maximum point distortion is 15.53 MPa and the maximum elongation is 64.09%. Further, according to the heat cycle accelerating test, in 1,000 cycle times, the number of broken pieces is 15 based on the 40 measured pieces. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009275240(A) 申请公布日期 2009.11.26
申请号 JP20080125195 申请日期 2008.05.12
申请人 KOKI:KK 发明人 TANAKA JUNICHI;KUROKAWA KAZUYA;YAMAUCHI HIROSHI;IRISAWA JUN;KAWAKUBO SATOSHI
分类号 C22C13/00;B23K35/26 主分类号 C22C13/00
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