发明名称 RESIN COMPOSITION AND FILM-FORMING MATERIAL CONTAINING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition which is suitably used for screen printing, can obtain stable electric characteristics at high temperature and at high humidity, is excellent in storage stability, and can reduce the sticking property to a polyimide film after curing, and to provide a film forming material containing the resin composition. Ž<P>SOLUTION: The resin composition contains a resin (A) and an inorganic filler and/or an organic filler (B), wherein the number-average molecular weight of the resin (A) is 22,000-50,000, and the inorganic filler and/or the organic filler (B) are/is dispersed in a resin solution comprising two or more resins (A) with mutually different number-average molecular weight values mixed with each other and containing a solvent. The film-forming material contains the resin composition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009275114(A) 申请公布日期 2009.11.26
申请号 JP20080127620 申请日期 2008.05.14
申请人 HITACHI CHEM CO LTD 发明人 UEHARA SATOSHI;HIRATA TOMOHIRO;KANEKO SUSUMU;KONDO SHUICHI;FUJII TETSUYA
分类号 C08L101/08;C08K3/26;C08K3/36;C08L63/00;C08L77/00;C08L79/08 主分类号 C08L101/08
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