| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which even when solder resist is present, a projection can be formed by forming copper plating thick on an optional position and which can be easily connected to a mounting component; and to provide a method of manufacturing the same. Ž<P>SOLUTION: The printed wiring board includes: copper foils 2a, 2b, 2c formed on the surface of a base 1; solder resists 3a, 3b formed on the base 1 so as to cover edge portions of the copper foil 2b; non-electrolytic copper plating 4 formed on the whole surface except portions above the solder resists 3a, 3b; a plating resist 5 formed on the whole surface and a dry film 6 overlapped on the plating resist; openings 5a, 6a formed by simultaneously exposing and simultaneously developing the plating resist 5 and the dry film 6; and electrolytic copper 7 formed in the openings by electrolytic plating using the non-electrolytic copper plating 4 as an electrode. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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