| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wired circuit board, preventing occurrence of a conductive foreign substance at the end part of upper surface of an insulating layer while easily preventing occurrence of a conductive foreign substance on the side end face of the insulating layer. SOLUTION: A conductive thin film 8, formed on the upper surface of a base insulating layer 3 and, on both side end faces in width direction, is coated with a photoresist 13, and is heated. A photomask is so arranged that both end parts in width direction of the conductive thin film 8 formed on the upper surface of the base insulating layer 3 as well as a portion where a conductive layer 6 is formed is shielded from light. The photoresist 13 is exposed from above through the photomask, and the photoresist 13 that covers the conductive thin film 8 formed on both side end faces in width direction of the base insulating layer 3 is exposed from below. A non-exposed portion of the photoresist 13 is removed to form a plated resist 14, and an end part conductive layer 7 and the conductive layer 6 are simultaneously formed on the conductive thin film 8 that is exposed from the plated resist 14. COPYRIGHT: (C)2010,JPO&INPIT
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