| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element attaching structure capable of attaching/detaching a semiconductor element to/from a heat radiation fin without being influenced by peripheral apparatuses. Ž<P>SOLUTION: A semiconductor attaching member composed of a fixing piece formed so as to have an approximately chevron cross section and allowed to be deformed to a flat shape when screwed into a printed broad from a lower portion and a pressing piece extended obliquely upward like an acute angle from the fixing piece and allowed to be further warped like an acute angle by the deformation of the fixing piece caused by screwing into the printed board is formed by a plate material, the fixing piece is screwed into the printed board, the pressing piece is warped by the deformation of the fixing piece caused by the screwing, and the semiconductor element is pressed and held onto the heat radiation fin formed on the printed board by the pressing piece. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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