发明名称 VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
摘要 The invention provides a vacuum processing apparatus having a function for removing particles on the surface of the sample stage in order to improve the yield of the sample being processed. The vacuum processing apparatus comprises a processing chamber 104 disposed in a vacuum reactor and having plasma formed in the interior thereof, a sample stage 113 placed below the processing chamber 104 and having a sample 102 to be processed placed on the upper plane thereof for processing, and a gas introducing mechanism placed at an upper portion of the processing chamber 104 and having introduction holes for introducing processing gas into the processing chamber, wherein the sample stage 113 comprises grooves 117 and a gas supply port 119 for introducing thermal conductance gas 118 between the sample stage and the sample 102 to be processed, and a mechanism for introducing dust removal gas 120 through the gas supply port 119 between the sample stage 113 and the sample 102 to be processed or a dummy sample 202 having substantially the same shape as the sample to be processed placed on the sample stage 113 within the vacuum reactor, by which particles 201 attached to the sample stage 113 are removed via hydrodynamic force by the dust removal gas 120.
申请公布号 US2009288684(A1) 申请公布日期 2009.11.26
申请号 US20080199820 申请日期 2008.08.28
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 KITAOKA KEN;SAKAGUCHI MASAMICHI;TAKAHASI KAZUE
分类号 B08B5/00;C23C14/34;C23C16/00;C23F1/08 主分类号 B08B5/00
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