发明名称 Heat sink for chips
摘要 A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
申请公布号 US2009288802(A1) 申请公布日期 2009.11.26
申请号 US20080155852 申请日期 2008.06.11
申请人 COMPTAKE TECHNOLOGY INC. 发明人 CHEN WEI-HAU;YEN STEVEN
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
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