| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the degree of freedom in use, when mounting a coil unit to an electronic apparatus, and to improve the degree of freedom in characteristics obtained by thinning. <P>SOLUTION: The coil units 12, 22 have coils 30, 130, wiring substrates 40, 140, and magnetic substances 60, 160 for forming the magnetic paths of the coils. Wiring substrates 40, 140 of the coil units have coil connection terminals 40b, 140b connected to both the ends of the coils, external connection terminals 41, 42, 141, 142, and wiring patterns 41a, 42a, 141a, 142a for connecting the coil connection terminals to the external connection terminals. No circuit element other than the coil is mounted on the wiring substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
