| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polyimide ink composition forming a protective film that satisfies recent requirements and has a low modulus of elasticity and a small warpage even in the case in which a small amount of expensive monomer such as OPDA is used, forming a protective film hardly causing whitening on a protective film in gold plating and bad condition of plating adhesion etc., and satisfying other properties required for FPC protective film such as sufficient flame retardance etc., by printing. <P>SOLUTION: The polyimide ink composition comprises a soluble polyimide resin being a condensation product of a diamine component containing a silicone diamine and an aromatic tricarboxylic acid dianhydride, a solvent dissolving the soluble polyimide resin in which the composition ratio of the silicone diamine in the diamine component is≥66 wt.% and≤80 wt.%. The protective film is formed from the polyimide ink composition. The flexible printed wiring board is equipped with the protective film. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
