发明名称 VISUAL INSPECTION METHOD FOR MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To perform quality determination, simply, with sure reliability, as to inspection for determining the quality of soldering for a circuit element, and especially, of soldering by means of a soldering robot or by means of manual work using a soldering iron. SOLUTION: As shown in Fig. 1 (A), a resistance 3 disposed on a green substrate 2 is photographed by a camera (imaging device) 4 disposed above the resistance 3 while the resistance 3 is illuminated via a special filter 6 made of milk-white acrylic by red coaxial illumination 5 from the camera 4 side. An image obtained by the photographing is black-and-white binarized to determine the quality of soldering. This method makes it possible to perform determination without being affected by flux 9 covering fillets 8 as shown in Fig. 1 (B). COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009276208(A) 申请公布日期 2009.11.26
申请号 JP20080127777 申请日期 2008.05.15
申请人 SHINDENSHI CORP 发明人 SUTOKI YOICHI
分类号 G01N21/95 主分类号 G01N21/95
代理机构 代理人
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