| 摘要 |
A sensor device having a sensing structure (2) integrated on a substrate (1) is packaged in a housing (10) by transfer molding. During molding and in order to protect the sensing structure (2), a deformable layer (35) of a mold section (30) abuts against a sacrificial buffer structure (6) protecting the sensing structure (2). The deformable layer (35) helps to keep an access window free, through which the buffer structure (6) can be removed once the housing (10) has hardened. |
