发明名称 SUBSTRATE CLAMPING APPARATUS
摘要 PURPOSE: A substrate clamping apparatus is provided to fix a large substrate firmly by widening a contact area by controlling a contact unit individually in parallel to the substrate surface. CONSTITUTION: A substrate clamping apparatus includes a contact unit, a control unit(160), a fixing unit, a first support(158a), and a second support(158b). The contact unit has a contact surface in contact with one side of the substrate. A control unit controls the contact unit to make the contact surface parallel to one side of the substrate. The first and second supports support the one side and the other side of the contact unit. The contact unit includes a first contact screw(156a) and a second contact screw(156b). The first and second control screws connect the fixing unit to the first and second supports. The first and second control screws control the position of the first and second support by the rotation.
申请公布号 KR20090122039(A) 申请公布日期 2009.11.26
申请号 KR20080048236 申请日期 2008.05.23
申请人 ADP ENGINEERING CO., LTD. 发明人 LEE, WON KEUN
分类号 H01L21/687 主分类号 H01L21/687
代理机构 代理人
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