METHOD OF MANUFACTURING JUNCTION STRUCTURE, AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a junction structure and a method of manufacturing a light-emitting device by which occurrence of voids in a junction interface of each substrate can be prevented and a junction structure of substrates with a good quality can be obtained.

SOLUTION: The junction structure 140 is manufactured by the steps of: forming a thin film on a junction surface of a first substrate 120 by an ambient pressure associated beforehand with a preset warp shape so that the first substrate 120 has the preset warp shape; and joining the first substrate 120 where the thin film is formed and a second substrate 110 by compression by means of adhesive materials 113 and 122.

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