| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus which fuses a jointing solder by radiation heating of a panel heater at a high heating temperature from the opposite side to the side of a surface on which electronic components of a board are mounted, wherein it is possible to solder the electronic components mounted onto the board are superheated to its heat resistance temperature without being thermally damaged, and to use an unleaded solder. SOLUTION: This reflow soldering apparatus includes: a panel heater 4 for heating and fusing a solder by heating a board W by a radiation heat or the radiation heat and a hot blast from the opposite side to the surface on which the electronic components are mounted; a superheat preventing means 5 for setting a temperature of the electronic component down to the heat resistance temperature or less by blasting a gas at a lower temperature than a solder fusing point onto the side of the surface on which the electronic components of the board are mounted; and a separator disposed between both side parts of a conveying path of the board and a sidewall of a heating chamber, for suppressing a rise of a temperature of the electronic components mounted on the board, inside a heating chamber 10. COPYRIGHT: (C)2010,JPO&INPIT |
