| 摘要 |
PROBLEM TO BE SOLVED: To provide a developing method and device for photoresist that suppresses residues even when an inorganic filler for improving solder thermal resistance, long-period reliability, and electric insulation and so on is added, damages neither a substrate nor the photoresist, and reduces costs. SOLUTION: The photoresist 11 is formed on the substrate 8, and exposed and then dipped in a developer 2 to be developed while a voltage is applied to the developer 2. At this time, a power source 4 is driven to apply the voltage to the developer 2 through electrodes 5 and 6. It is preferred that the voltage is applied to the developer 2 before the substrate 8 is dipped. COPYRIGHT: (C)2010,JPO&INPIT |
