METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TRAY, AND SUBSTRATE STORAGE DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the manufacturing yield and reliability of a semiconductor device. SOLUTION: A rubber member is brought into contact with a wiring board outside an element mounting region, and an unpolymerized component of a rubber member is transferred to outside the element mounting region. Then a semiconductor element is mounted in the element mounting region, and a resin material for sealing is charged in the gap between the wiring board and semiconductor element. The resin material for sealing is cured to form a sealing resin made of an underfill material in the gap between the wiring substrate and semiconductor element. Consequently, the manufacturing yield and reliability of the semiconductor device are improved. COPYRIGHT: (C)2010,JPO&INPIT