| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of avoiding a bult-in of an antenna in a semiconductor device because input impedance may be reduced when an antenna is connected to a semiconductor chip through ESD (electrostatic discharge) protection circuit, and ESD destruction may occur when the antenna is directly connected to the semiconductor chip. SOLUTION: In a semiconductor package, most part of an antenna is arranged outside a semiconductor device and only a part of the antenna and a matching circuit are built in the semiconductor device. The part of the antenna and the matching circuit are formed by combining a lead frame of the semiconductor package and bonding wires 11, 12, 14 to 19. COPYRIGHT: (C)2010,JPO&INPIT
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