| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect inspecting device which performs high-speed inspection under a plurality of optical conditions when inspecting defects or foreign substances existing within a semiconductor wafer. SOLUTION: This defect inspection device is used for inspecting the defect, such as, foreign substance on a sample having a circuit pattern, such as wiring. The defect inspecting device includes a lighting optical system which emits each of a plurality of straight beams onto different inspection regions on the sample, and an imaging optical system which images the plurality of emitted inspection regions onto a detector. The detector is constituted so as to receive a plurality of mutually different polarization components to each other, which are contained in each of a plurality of optical images imaged by the imaging optical system simultaneously and separately, and detect them as a plurality of signals corresponding to the plurality of polarization components. COPYRIGHT: (C)2010,JPO&INPIT
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