| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an interposer wherein alignment with higher precision is possible. Ž<P>SOLUTION: This method of manufacturing an interposer includes a step to form a wiring layer serving as a first layer and form an insulating layer on the wiring layer serving as the first layer, a step to form a recess for wiring to provide the wiring layer serving as the second layer and a via hole which is an opening to connect the wiring layer serving as the first layer to the recess for wiring by exposing the insulating layer using a mask, a step to form the wiring layer serving as the second layer by filling the recess for wiring with conductive material and to form a via for electrically connecting the wiring layer serving as the first layer and the wiring layer serving as the second layer by filling the via hole with conductive material, and a step to remove the insulating layer unnecessary for the wiring layer serving as the second layer. A wiring part to form the recess for wiring, and a via part to form the via hole are provided in the mask, an exposure difference is provided in the wiring part and the via part so that the amount of exposure becomes more in the via part than in the wiring part, and the via hole is formed deeper than the recess for the wiring. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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