| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device, wherein a degree of freedom of the arrangement to a printed wiring board is enhanced and also the occurrence of cracks of a package is avoided. SOLUTION: The surface acoustic wave device includes: a surface acoustic wave element; and the package for housing the surface acoustic wave element, wherein the package includes a notch formed to its apex angle and a plurality of notches at least one of which is formed to each side, a conductive film is formed to side faces of the package corresponding to the notches, a rear side of the package has a region formed with a conductor pattern electrically connected to input output terminals of the surface acoustic wave element, a region formed with a conductor pattern electrically connected to a ground terminal of the surface acoustic wave element, and a region not formed with the conductor pattern at a plurality of positions corresponding to the notches of the rear side, and the region not corresponding to the notches of the rear side of the package and not formed with the conductor pattern is provided corresponding to the layout of the wiring pattern or the through-holes formed to the printed wiring board mounted on the surface acoustic wave device. COPYRIGHT: (C)2006,JPO&NCIPI
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