INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED FARADAY SHIELD

摘要

A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate, the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate by an electrically conductive adhesive material (136). The second substrate includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate. The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first and the second substrates and functionally coupled to the first and/or the second circuit coupling features. In the packaged IC, the adhesive material electrically couples the first and the second shielding layers.