| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board for stably operating electronic components such as semiconductor device or the like to be mounted under the condition that the occurrence of cracks on the ceramic board is prevented during bonding of signal terminals to the ceramic circuit board without lowering of mechanical strength thereof and moreover higher bonding strength is achieved between the metal circuit board and signal terminals. SOLUTION: The ceramic circuit board, where signal terminals 3 are deposited on the front surface of a metal circuit board 2 bonded to the ceramic board 1 by fusing surfaces thereof with the ultrasonic wave bonding method, is characterized in that a contact portion, where the metal circuit board 2 is placed in contact with the signal terminals 3, is provided in the region provided at the external side of the fusing portion 4 between the metal circuit board 2 and the signal terminals 3 when viewed from the plane and the metal circuit board 2 is formed by brazing oxygen-free copper to the ceramic board 1. COPYRIGHT: (C)2006,JPO&NCIPI
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