METHOD FOR MANUFACTURING MOUNTING STRUCTURE, AND MOUNTING STRUCTURE

摘要

During manufacture of a mounting structure, even if an electronic component is aligned with high precision to be mounted on a circuit board in a mounting process, a bump and an electrode on a circuit board aligned with each other are slipped at a compression step in a subsequent bonding process. A method for manufacturing a mounting structure comprises an insulating resin arrangement step for forming two kinds of insulating resin (19), i.e. first insulating resin (17) curing at a first curing temperature and second insulating resin (16) curing at a second curing temperature higher than the first curing temperature on a circuit board (14), a mounting step for performing alignment such that a bump (13) formed on an electronic component (11) faces a counter electrode (15) on the circuit board, and a main compression step for bonding an electronic component and the circuit board by performing main compression thereafter. The method further comprises a first curing step for heating the resin to reach the first curing temperature before or during the main compression, and a second curing step for heating the resin to reach the second curing temperature during or after the main compression after the first insulating resin has cured.