发明名称 Forming of a single-crystal semiconductor layer portion separated from a substrate
摘要 A method for forming a single-crystal semiconductor layer portion above a hollowed area, including growing by selective epitaxy on an active single-crystal semiconductor region a sacrificial single-crystal semiconductor layer and a single-crystal semiconductor layer, and removing the sacrificial layer. The epitaxial growth is performed while the active region is surrounded with a raised insulating layer and the removal of the sacrificial single-crystal semiconductor layer is performed through an access resulting from an at least partial removal of the raised insulating layer.
申请公布号 US7622368(B2) 申请公布日期 2009.11.24
申请号 US20070704638 申请日期 2007.02.09
申请人 STMICROELECTRONICS S.A. 发明人 DUTARTRE DIDIER;LOUBET NICOLAS;TALBOT ALEXANDRE
分类号 H01L21/20;H01L21/36 主分类号 H01L21/20
代理机构 代理人
主权项
地址