发明名称 |
Semiconductor device, interposer chip and manufacturing method of semiconductor device |
摘要 |
A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.
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申请公布号 |
US7622799(B2) |
申请公布日期 |
2009.11.24 |
申请号 |
US20060617239 |
申请日期 |
2006.12.28 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
KURODA SOSHI;YASUDA NAOYA;ARAKAWA HIDEYUKI;YAMAZAKI AKIRA;BANDO KOJI |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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